For EMS (Electronics Manufacturing Services), OFROM realizes your cost reduction
needs and reliably supports manufacturers’ transition to fabless manufacturing
through outsourcing manufacturing. We apply total production focused on high-density
mounting technology to assist you with your EMS strategy, including the
manufacturing and corporate strategies that comprise it.
From products made through either mass- or high-mix, low-volume production to
complex, special-order products, OFROM’s latest factory flexibly accommodates a
variety of orders for all kinds of products.Our solid production framework handles
total production throughout the design, manufacturing and quality control processes
in their entirety.
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We have established a high-quality
mounting system for BGA/LGA/FC devices.We set optimal manufacturing conditions using our technological prowess in mounting and analytical capability, which we have developed over a period of 30 years.
Cross-section inspection
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We apply our own self-designed inspection
equipment.To satisfy product gurantee items, we apply the inspection equipment whch are designed and manufactured by OFROM to check those items, including operation, withstanding pressure and insulation resistance.
Electrical tester
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Our knowledge and skill of soldering ranks
among the global standard.We have implemented the “Micro Soldering Skill Qualification” certification system devised by the Japan Welding Engineering Society (JWES). Our adopted manufacturing standard is “products that are dependable even after 10 years.”
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We have achieved absolute quality in module
board mounting.We have achieved absolute quality in the mounting and assembly of module boards with zero defects yielded out of 1.5 million units produced. We were recognized with a Letter of Appreciation for our contributions to high quality in this regard.
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C4 method.
This enables us to mount bare chips with a ball pitch of 150μm, considered to be impossible with solder printing.
C4 method mounting
board -
High-density / fine-pitch mounting.
OFROM handles the mounting of chips with an adjoining distance of 100μm and a size of 0402.
0402 chip
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Flow soldering for BGA-fitted boards.
Using our proprietary DIP pallet design technology, we are capable of realizing flow soldering for BGA- fitted multi-layer boards.
DIP palette
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Reduced product costs through automation.
We have automation technology that covers soldering, grease/resin coating, screw tightening and electric/image/communication inspections.
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Reliable Quick Delivery.
By virtue of having a mounting line dedicated to test production, we accept orders starting with those for a single unit and are able to accommodate delivery times as short as one day. We are also adept at mass production using our 3 high-speed mounting lines, which are capable of outputting a maximum of 49 million units per month.
SMT line
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We handle high-mix, low-volume production.
We leverages its manufacturing and production management systems to accommodate the production of approx. 2,000 models.
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Our assembly processes are designed in line
with the production configuration.At OFROM, we design optimal assembly processes based on the production system (cell, line or lot production) that matches the production configuration at hand.
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Self-manufacturing of unique jigs internally.
Our production internalization efforts have enabled us to establish quickly production framework for jigs. we also offer on a direct sales basis.
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We offers competitive parts
procurement capability.Our procurement network exceeds 100 companies both inside and outside of Japan. We also pride ourselves on the price handling capability made possible by purchasing volume across the OFROM Group.
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Handles development and design incorporating manufacturing perspectives.
Our design record includes crime prevention devices, image inspection equipment, parts related to medical equipment, and special fiber detection apparatus.
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Displacement
sensors -
Level difference
recognition sensors -
Color vision
sensor -
2D Dispacement
sensor -
Photoelectronic
sensors -
Separate type
displacement
sensors -
LED Ring
lighting -
LED Bar
lighting
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Indoor/ceiling-
mounted passive
sensors -
Outdoor active
sensors -
Crime prevention
receivers -
Outdoor passive
sensors -
Sensor
lights -
LED sensor
lights -
Safe driving
assistance devices -
3D range image
cameras
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PoE+Intelligence
LTE Gateway -
Specially designed
for outdoor use
PoE+LTE
Gateway(w/wifi) -
Specially designed
for outdoor use
PoE+LTE Gateway
(high power) -
Real time
Image Clarifying
Unit Control -
Control
PCB
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